Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure-Reference-Cited by-同舟云学术

Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure

Published:2015 Issue:37 Volume:3 Page:9594-9602
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Wei Yong¹²³⁴⁵,Chen Song¹²³⁴⁵,Lin Yong¹²³⁴⁵,Yang Zimei¹²³⁴⁵,Liu Lan¹²³⁴⁵

Affiliation:

1. College of Materials Science and Engineering

2. Key Lab of Guangdong Province for High Property and Functional polymer Materials

3. South China University of Technology

4. Guangzhou 510641

5. P. R. China

Abstract

Cu–Ag core–shell nanowires with excellent oxidation resistance are fabricated and are used as conductive fillers for e-skin with a petal molded micro-structure.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/TC/C5TC01723H

Reference51 articles.

1. 25th Anniversary Article: The Evolution of Electronic Skin (E-Skin): A Brief History, Design Considerations, and Recent Progress

2. Stretchable and self-healing polymers and devices for electronic skin

3. Hybrids of silver nanowires and silica nanoparticles as morphology controlled conductive filler applied in flexible conductive nanocomposites

4. Highly Stretchy Black Gold E-Skin Nanopatches as Highly Sensitive Wearable Biomedical Sensors

5. A wearable and highly sensitive pressure sensor with ultrathin gold nanowires

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