Thiourea modified low molecular polyamide as a novel room temperature curing agent for epoxy resin
Author:
Affiliation:
1. Xi'an Institute of High Technology, Xi'an 710000, China
Abstract
Funder
Natural Science Foundation of Shaanxi Province
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2022/RA/D2RA02693G
Reference33 articles.
1. Recent Developments in the Flame-Retardant System of Epoxy Resin
2. The effect of SiO2 nano-filler on dielectric properties of epoxy resin
3. Latent curing epoxy system with excellent thermal stability, flame retardance and dielectric property
4. Phosphorus/sulfur-containing aliphatic polyamide curing agent endowing epoxy resin with well-balanced flame safety, transparency and refractive index
5. Synthesis and application of thermal latent initiators of epoxy resins: A review
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