The laser writing of highly conductive and anti-oxidative copper structures in liquid-Reference-Cited by-同舟云学术

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The laser writing of highly conductive and anti-oxidative copper structures in liquid

Published:2020 Issue:2 Volume:12 Page:563-571
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Zhou Xingwen¹²³⁴^ORCID,Guo Wei¹²³⁴,Zhu Ying¹²³⁴,Peng Peng¹²³⁴⁵^ORCID

Affiliation:

1. School of Mechanical Engineering and Automation

2. Beihang University

3. Beijing 100191

4. China

5. International Research Institute for Multidisciplinary Science

Abstract

An in situ laser patterning technique for manufacturing flexible Cu-based electrodes from a liquid precursor is demonstrated.

Funder

National Natural Science Foundation of China

National Basic Research Program of China

Natural Science Foundation of Beijing Municipality

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2020/NR/C9NR07248A

Reference46 articles.

1. Skin-Like Oxide Thin-Film Transistors for Transparent Displays

2. Wearable humidity sensor based on porous graphene network for respiration monitoring

3. Stretchable and Multimodal All Graphene Electronic Skin

4. Fast Plasmonic Laser Nanowelding for a Cu-Nanowire Percolation Network for Flexible Transparent Conductors and Stretchable Electronics

5. Flexible and Transparent Cu Electronics by Low-Temperature Acid-Assisted Laser Processing of Cu Nanoparticles

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1. Wavelength-influenced electrical performance of laser-written flexible copper-based structures;Nanotechnology;2024-08-13

2. Femtosecond laser direct writing of highly conductive copper for bendable electrodes with excellent bendability;Journal of Manufacturing Processes;2024-08

3. Fabrication of Flexible Copper Microelectrodes Using Laser Direct Writing for Sensing Applications;physica status solidi (a);2024-06-27

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5. Rheological Investigation of Highly Filled Copper(II) Oxide Nanosuspensions to Optimize Precursor Particle Content in Reductive Laser-Sintering;Liquids;2024-04-24

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