Adhesion enhancement of ink-jet printed conductive copper patterns on a flexible substrate
Author:
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2012/JM/C2JM31381B
Reference41 articles.
1. High-Resolution Inkjet Printing of All-Polymer Transistor Circuits
2. Inkjet Printing for Materials and Devices
3. Inkjet Printing of Conjugated Polymer Precursors on Paper Substrates for Colorimetric Sensing and Flexible Electrothermochromic Display
4. Inkjet-printed electrochromic devices utilizing polyaniline–silica and poly(3,4-ethylenedioxythiophene)–silica colloidal composite particles
5. Inkjet-Printed Single-Droplet Organic Transistors Based on Semiconductor Nanowires Embedded in Insulating Polymers
Cited by 75 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications;IEEE Journal of the Electron Devices Society;2024
2. Preparation and Interfacial Analysis of Ag/Cu Coating on Acrylonitrile Butadiene Styrene Surface by Chemical Etching and Self-assembly Modification;Journal of Materials Engineering and Performance;2023-08-11
3. Metallized Plastic Foils: A Promising Solution for High‐Energy Lithium‐Ion Battery Current Collectors;Advanced Energy Materials;2023-08-09
4. Enhancing the adhesion strength of ink-jet printed indium tin oxide films: The role of printing parameters;Materials & Design;2023-08
5. Highly flexible and multifunctional CNTs/TPU fiber strain sensor formed in one-step via wet spinning;Journal of Alloys and Compounds;2023-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3