Effect of flake silver-plated copper particles on the property enhancement of electrically conductive adhesives-Reference-Cited by-同舟云学术

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Effect of flake silver-plated copper particles on the property enhancement of electrically conductive adhesives

Published:2023 Issue:14 Volume:25 Page:10022-10032
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Cheng Na¹^ORCID,Sun Zhi¹,Yu Xiaohui²,Yu Qianzhen¹,Zhao Jianwei¹^ORCID

Affiliation:

1. College of Material and Textile Engineering, Key Laboratory of Yarn Materials Forming and Composite Processing Technology, Jiaxing University, Jiaxing 314001, Zhejiang, China

2. College of Design, Jiaxing University, Jiaxing 314001, Zhejiang, China

Abstract

This work reported a new method of using the displacement method to prepare flake Cu@Ag particles, and then mixing them with epoxy resin to obtain ECAs with higher conductivity and shear strength.

Funder

National Natural Science Foundation of China

Science and Technology Bureau of Jiaxing City

Natural Science Foundation of Zhejiang Province

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2023/CP/D3CP00209H

Reference27 articles.

1. Characterization of magnetron sputtered Cr–B and Cr–B–C thin films for electrical contact applications

2. Effects of Y2O3 on the property of copper based contact materials

3. Recent progress in flexible–wearable solar cells for self-powered electronic devices

4. Flexible electronics based on inorganic nanowires

5. Weaving a magnificent world: 1D fibrous electrodes and devices for stretchable and wearable electronics

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