Recycled and flexible boron nitride heat spread film with high thermal conductivity-Reference-Cited by-同舟云学术

Recycled and flexible boron nitride heat spread film with high thermal conductivity

Published:2023 Issue:39 Volume:11 Page:13204-13212
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Zhang Jianxiang¹²,Kong Xiangdong¹²,Wang Yandong²,Zhang Zhenbang²,Li Linhong²,Xu Kang²,Li Maohua²,Yang Rongjie²,Zhou Yiwei²,Cai Tao²^ORCID,Dai Wen²^ORCID,Lin Cheng-Te²³^ORCID,Nishimura Kazuhito²,Pan Zhongbin¹^ORCID,Jiang Nan²³,Yu Jinhong²³^ORCID

Affiliation:

1. School of Materials Science and Chemical Engineering, Ningbo University, Ningbo, Zhejiang 315211, China

2. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China

3. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, China

Abstract

The large-scale production of boron nitride (BN)/polyvinyl butyral (PVB) composite films with excellent thermal conductivity and recyclable properties was achieved through tape-casting and vacuum hot-pressing techniques.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/TC/D3TC02761A

Reference48 articles.

1. Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading

2. Emerging challenges and materials for thermal management of electronics

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