Microscopical Morphology of Adsorbate Produced during Two-step Catalyzation Pretreatment and Deposit Formed at Initial Stage of Electroless Ni-P Deposition on Non-conductive Substrates
Author:
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Reference30 articles.
1. 1) 表面技術便覧, p. 390 (日刊工業新聞社, 1998)
2. 2) M. Paunovic, M. Schlesinger ; Fundamentals of Electrochemical Deposition, p. 147 (John Wiley & Sons, Inc., 1998)
3. Solution Chemistry and Colloid Formation in the Tin Chloride Sensitizing Process
4. The Nucleation with SnCl[sub 2]-PdCl[sub 2] Solutions of Glass Before Electroless Plating
5. A Rutherford Scattering Study of Catalyst Systems for Electroless Cu Plating: II . Sensitization and Activation
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