Electroless Deposition of Ni-Sn Layers Having High Sn Content (>30 at.%) on Fe Substrates (1)
Author:
Affiliation:
1. Faculty of Engineering, Kanagawa University
2. Sun Industry Co., Ltd.
3. Research Institute for Engineering, Kanagawa University
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/sfj/71/9/71_577/_pdf
Reference1 articles.
1. Effect of sodium stannate on low temperature electroless Ni − Sn − P deposition and the study of its mechanism
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1. Chemical Resistance Property of Electroless Deposited Ni–Sn–P Layers Having High Sn Content;ACS Sustainable Chemistry & Engineering;2023-05-08
2. Development of electroless NiSnP plating with excellent bath stability using nickel hydroxide;Transactions of the IMF;2023-02-23
3. Effects of Electroless NiSnP Plating Bath Composition with High Sn Containing Deposited Film;Journal of The Surface Finishing Society of Japan;2022-05-01
4. Examination on Chemical Resistance Property of Ni-Sn Layers Having High Sn Content against Sodium Hypochlorite Aqueous Solutions;Journal of The Surface Finishing Society of Japan;2021-05-01
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