New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. Copper Deposition System for Sub-micron Patterning.
-
Published:1998
Issue:11
Volume:49
Page:1176-1179
-
ISSN:0915-1869
-
Container-title:Journal of the Surface Finishing Society of Japan
-
language:
-
Short-container-title:J. Surf. Finish Soc. Jpn.
Author:
TANIGUCHI Kazuhiro
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. 10.4139/sfj.55.907;Journal of The Surface Finishing Society of Japan;2004