Metallizing to PBT by Low Vacuum Cu Sputtering-Reference-Cited by-同舟云学术

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Metallizing to PBT by Low Vacuum Cu Sputtering

Published:2021-04-01 Issue:4 Volume:72 Page:225-229
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:en
Short-container-title:Journal of the Surface Finishing Society of Japan

Author:

YAMAGISHI Toshimichi¹²,INOUE Tomoaki¹,SARUWATARI Tetsuya³,WATANABE Mitsuhiro²⁴

Affiliation:

1. Tsukada Riken Industry Co.,Ltd.

2. Graduate School of Engineering, Kanto Gakuin University

3. Shimadsu Corporation

4. Materials and Surface Engineering Research Institute, Kanto Gakuin University

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/72/4/72_225/_pdf

Reference16 articles.

1. 1）T. Bessho ; J. Surf. Finish. Soc. Jpn., 62, 652（2011）.

2. 2）日本化学会編 ; 化学便覧応用編, p.1140（丸善出版, 2014）.

3. 3）E. Enomoto, T. Murata ; J. Surf. Finish. Soc. Jpn., 59, 282（2008）.

4. 4）T. Matsuoka, K. Sakaguchi, C. Hata ; J. Soc. Mat. Sci. Japan, 51, 1038（2002）.

5. 5）K. Yoshihisa, A. Yoshimura, Y. Shibamori, K. Fuchigami, N. Kubota ; IHI Giho., 52, 65（2012）.

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