Author:
ARAI Susumu,ENDO Morinobu
Publisher
The Surface Finishing Society of Japan
Cited by
4 articles.
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1. Plating Machine for Semiconductor Wafer and the Future;Journal of The Surface Finishing Society of Japan;2017-11-01
2. Composite Plating of Nanoparticles;Journal of The Surface Finishing Society of Japan;2011
3. Enhancement of Electrical Conductivity of Copper/Carbon-Nanotube Composite Wire;Journal of the Japan Institute of Metals;2009
4. 10.4139/sfj.58.76;Journal of The Surface Finishing Society of Japan;2007