The Study of Pretreatment Process Using Sol Prepared from Tin (IV) Chloride for Electroless Plating and Application to Selective Plating
Author:
Affiliation:
1. Nagano Prefecture General Industrial Technology Center
2. Interdisciplinary Graduate School of Science and Technology, Shinshu University
Publisher
The Surface Finishing Society of Japan
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/sfj/66/1/66_14/_pdf
Reference5 articles.
1. 1) H. Enomoto, T. Murata ; J. Surf. Finish. Soc. Jpn., 59, 282 (2008).
2. 3) H. Ushijima ; J. Surf. Finish. Soc. Jpn., 64, 572 (2013).
3. 8) W. Lu, H. Schmidt ; Adv. Powder Technol., 19, 1 (2008).
4. 9) H. Nishida ; Bunseki Kagaku., 12, 57 (1963).
5. 10) H. Nishida ; Bunseki Kagaku., 13, 59 (1964).
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Palladium-free Cu Electroplating Using Heat-treated SnO<sub>2</sub> Film on the Glass;Journal of The Surface Finishing Society of Japan;2023-03-01
2. Study of Pretreatment Process Using Tin Oxide Sol for Electroless Plating and Application to Selective Plating;Journal of the Surface Finishing Society of Japan;2016
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