Decomposition of Organic Impurities in Copper Sulfate Plating Solution by Ozone Fine Bubble Treatment-Reference-Cited by-同舟云学术

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Decomposition of Organic Impurities in Copper Sulfate Plating Solution by Ozone Fine Bubble Treatment

Published:2024-05-01 Issue:5 Volume:75 Page:231-235
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

NISHITANI Shigeo¹²³,WAGATSUMA Yuya¹²,SASAKI Yuki¹²,UMEDA Yasushi²,HONMA Hideo²,TAKAI Osamu²,TASHIRO Katsuhiko²⁴

Affiliation:

1. Doctoral Course in Interdisciplinary Engineering, Graduate School of Engineering, Kanto Gakuin University

2. Material and Surface Engineering Research Institute, Kanto Gakuin University

3. Usugidenkai Co., Ltd.

4. Department of Science and Technology, Kanto Gakuin University

Publisher

The Surface Finishing Society of Japan

Link

https://www.jstage.jst.go.jp/article/sfj/75/5/75_231/_pdf

Reference12 articles.

1. 1）ISO 20480-1:2017, Fine bubble technology - General principles for usage and measurement of fine bubbles - Part 1: Terminology.

2. 2）K-rip Fine bubble application case studies（4th ed.＋ enlarged and supplemented edition）. https://k-rip.gr.jp/publicca-tion/cat_publication/finebubble,（2022）.

3. https://k-rip.gr.jp/wp/wp-content/uploads/2018/03/finebubble_ver4.pdf

4. 3）S. Nishitani, Y. Umeda, H. Honma, O. Takai, K. Tashiro ; Hyomen Gijutsu Lecture series, Vol.146, p.146（2022）.

5. 4）H. Honma, H. Kosai, S. Sugimoto ; Published Granted Patent（Second Level）JP4242310B2（2004）.

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