Fabrication of Fine Copper Structure on Both Sides by Thermal Nanoimprint-Reference-Cited by-同舟云学术

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Fabrication of Fine Copper Structure on Both Sides by Thermal Nanoimprint

Published:2015 Issue:9 Volume:66 Page:425-430
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

SAITOU Takayuki¹,KATAYAMA Naoki¹,MIYAMA Katsumi²,YAJIMA Masaki³,WATANABE Hideo³

Affiliation:

1. Industrial Research Institute, Hokkaido Research Organization

2. Department of Engineering, Hokkaido University of Science

3. Atotech Japan K.K.

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/66/9/66_425/_pdf

Reference4 articles.

1. 1) S. Y. Chou, P. R. Krauss, P. J. Renstrom ; Appl. Phys. Lett., 67, 3114 (1995).

2. 4) K. Miyama ; J. Surf. Finish. Soc. Jpn., 65, 344 (2014).

3. 5) T. Saitou, N. Katayama, K. Yoshida, S. Saitou, K. Miyama ; Abst. 129th Meet., p.100 (Surf. Finish. Soc. Jpn., 2014).

4. 7) B. Roelfs, N. Dambrowsky, C. Erben, S. Kenny ; Proc. SMTA Int. 2011 Conf., “New Challenges for Higher Aspect Ratio: Filling Through Holes and Blind Micro Vias with Copper by Reverse Pulse Plating” (SMTA, 2011).

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