Separation and Recovery of Tin from Waste Printed Circuit Boards

Author:

TANINOUCHI Yu-ki1

Affiliation:

1. Department of Materials, Kyushu University

Publisher

The Surface Finishing Society of Japan

Reference40 articles.

1. 1)M. Kaya ; Electronic waste and printed circuit board recycling technologies(Springer International Publishing, 2019).

2. 2)C. P. Baldé, E. D'Angelo, V. Luda, O. Deubzer, R. Kuehr ; Global Transboundary E-waste Flows Monitor - 2022(United Nations Institute for Training and Research(UNITAR), Bonn, Germany, 2022). https://ewastemonitor.info/gem-2020/

3. 3)K. Parajuly, R. Kuehr, A. K. Awasthi, C. Fitzpatrick, J. Lepawsky, E. Smith, R. Widmer, X. Zeng ; Future E-waste Scenarios(StEP(Bonn), UNU ViE-SCYCLE(Bonn)& UNEP IETC(Osaka), 2019). http://collections.unu.edu/eserv/UNU:7440/FUTURE_E-WASTE_SCENARIOS_UNU_190829_low_screen.pdf

4. 4)H. Li, J. Eksteen, E. Oraby ; Resources, Conservation and Recycling, 139, 122(2018). https://doi.org/10.1016/j.resconrec.2018.08.007

5. 5)J. Guo, J. Guo, Z. Xu ; Journal of Hazardous Materials, 168,(2-3), 567(2009). https://doi.org/10.1016/j.jhazmat.2009.02.104

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