Hydrogen Absorption into Electroplated Palladium Films and Formation of the Compressive Stress-Reference-Cited by-同舟云学术

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Hydrogen Absorption into Electroplated Palladium Films and Formation of the Compressive Stress

Published:2012 Issue:10 Volume:63 Page:646-650
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

TSURU Yutaka,UCHIYAMA Hiroki,YANO Masaaki

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Reference17 articles.

1. 2）G. O. Mallory, J. B. Hajdu ; Electroless Plating: Fundamentals and Applications, p.346（AESF, 1990）.

2. 3）S. Uemiya; J. Surf. Finish. Soc. Jpn, 59, 6（2008）.

3. 5）Y.-G. Jung, Y. Sakai ; J. Soc. Mat. Sci. Japan, 50, 999（2001）.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applications and Technology Trend of Palladium Electroplating;Journal of The Surface Finishing Society of Japan;2019-09-01

2. Effect of Direct Current, Pulsed Current and Periodic Reverse Current Electrolysis Conditions on the Internal Strain in Cobalt Deposit;Journal of The Surface Finishing Society of Japan;2017-07-01

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