Mechanisms of Solid Electrolyte Deposition of Copper Using Cation Exchange Membrane-Reference-Cited by-同舟云学术

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Mechanisms of Solid Electrolyte Deposition of Copper Using Cation Exchange Membrane

Published:2019-01-01 Issue:1 Volume:70 Page:40-44
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:en
Short-container-title:Journal of the Surface Finishing Society of Japan

Author:

ITAGAKI Masayuki¹²³,NARUI Yuka²,KOJIMA Kenta²,HOSHI Yoshinao¹²,SHITANDA Isao¹²³,YANAGIMOTO Hiroshi⁴,HIRAOKA Motoki⁴,IISAKA Hirofumi⁴

Affiliation:

1. Faculty of Science and Technology, Tokyo University of Science

2. Graduate School of Science and Technology, Tokyo University of Science

3. Research Institute for Science and Technology, Tokyo University of Science

4. Material Development Div, Toyota Motor Corporation

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/70/1/70_40/_pdf

Reference1 articles.

1. The Next Step to Higher Density Multilayer PWBs Using Microvia Technologies. Status of Build up PCB and the Technology by Photo-Sensitive Epoxy Resin.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroplating Techniques with Solid Electrolyte;Journal of The Surface Finishing Society of Japan;2020-12-01

2. Trends in Plating Technology that complies with Environmental Regulations;Journal of The Surface Finishing Society of Japan;2020-12-01

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