HflX is a ribosome-splitting factor rescuing stalled ribosomes under stress conditions
Author:
Publisher
Springer Science and Business Media LLC
Subject
Molecular Biology,Structural Biology
Link
http://www.nature.com/articles/nsmb.3103.pdf
Reference80 articles.
1. Verghese, J., Abrams, J., Wang, Y. & Morano, K.A. Biology of the heat shock response and protein chaperones: budding yeast (Saccharomyces cerevisiae) as a model system. Microbiol. Mol. Biol. Rev. 76, 115–158 (2012).
2. Richter, K., Haslbeck, M. & Buchner, J. The heat shock response: life on the verge of death. Mol. Cell 40, 253–266 (2010).
3. Yura, T., Nagai, H. & Mori, H. Regulation of the heat-shock response in bacteria. Annu. Rev. Microbiol. 47, 321–350 (1993).
4. Lindquist, S. Regulation of protein synthesis during heat shock. Nature 293, 311–314 (1981).
5. Spriggs, K.A., Bushell, M. & Willis, A.E. Translational regulation of gene expression during conditions of cell stress. Mol. Cell 40, 228–237 (2010).
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