Predictability of resin bonded bridges – a systematic review
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Dentistry
Link
http://www.nature.com/articles/sj.bdj.2017.497.pdf
Reference49 articles.
1. Rochette A L . Attachment of a splint to enamel of lower anterior teeth. J Prosthet Dent 1973; 30: 418–423.
2. Howe D F, Denehy G E . Anterior fixed partial dentures utilizing the acid-etch technique and a cast metal framework. J Prosthet Dent 1977; 37: 28–31.
3. Thompson V P, Livaditis G J . Etched casting acid etch bonded composite posterior bridges. Pediatr Dent 1982; 4: 38–43.
4. Creugers N H, Van 't hof M A . An analysis of clinical studies on resin-bonded bridges. J Dent Res 1991; 70: 146–149.
5. Mowafy O, Rubo M H . Resin-bonded fixed partial denturesa literature review with presentation of a novel approach. Int J Prosthodont 2000; 13: 460–467.
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