Low-dielectric-constant polyimide aerogel composite films with low water uptake-Reference-Cited by-同舟云学术

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Low-dielectric-constant polyimide aerogel composite films with low water uptake

Published:2016-03-30 Issue:7 Volume:48 Page:829-834
ISSN:0032-3896
Container-title:Polymer Journal
language:en
Short-container-title:Polym J

Author:

Kim Jinyoung,Kwon Jinuk,Kim Myeongsoo,Do Jeonguk,Lee Daero,Han Haksoo

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Polymers and Plastics

Link

http://www.nature.com/articles/pj201637.pdf

Reference34 articles.

1. Wang, W., Grozea, D., Kim, A., Perovic, D. D. & Ozin, G. A. Vacuum‐assisted aerosol deposition of a low‐dielectric‐constant periodic mesoporous organosilica film. Adv. Mater. 22, 99–102 (2010).

2. Homma, T. Low Dielectric Constant Materials and Methods for Interlayer Dielectric Films in Ultralarge-Scale Integrated Circuit Multilevel Interconnections. Mater. Sci. Eng. R Rep. 23 (6), 243–285 (1998).

3. Maex, K., Baklanov, M. R., Shamiryan, D., Lacopi, F., Brongersma, S. H. & Yanovitskaya, Z. S. Low dielectric constant materials for microelectronics. J. Appl. Phys 93, 8793 (2003).

4. Cole, M. W., Nothwang, W. D., Hubbard, C., Ngo, E. & Ervin, M. Low dielectric loss and enhanced tunability of Ba0. 6Sr0. 4TiO3 based thin films via material compositional design and optimized film processing methods. J. Appl. Phys. 93, 9218 (2003).

5. Leu, C., Chang, Y. & Wei, K. Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric film applications. Chem. Mater. 15, 3721–3727 (2003).

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