Genome-wide mapping of nucleotide excision repair with XR-seq
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Biochemistry, Genetics and Molecular Biology
Link
http://www.nature.com/articles/s41596-018-0093-7.pdf
Reference65 articles.
1. Sancar, A. Mechanisms of DNA repair by photolyase and excision nuclease (Nobel Lecture). Angew. Chem. Int. Ed. Engl. 55, 8502–8527 (2016).
2. Wood, R. D. Nucleotide excision repair in mammalian cells. J. Biol. Chem. 272, 23465–23468 (1997).
3. Hu, J., Selby, C. P., Adar, S., Adebali, O. & Sancar, A. Molecular mechanisms and genomic maps of DNA excision repair in Escherichia coli and humans. J. Biol. Chem. 292, 15588–15597 (2017).
4. Gong, F., Kwon, Y. & Smerdon, M. J. Nucleotide excision repair in chromatin and the right of entry. DNA Repair (Amst) 4, 884–896 (2005).
5. Hanawalt, P. C. & Spivak, G. Transcription-coupled DNA repair: two decades of progress and surprises. Nat. Rev. Mol. Cell. Biol. 9, 958–970 (2008).
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