Integrated germanium optical interconnects on silicon substrates-Reference-Cited by-同舟云学术

Integrated germanium optical interconnects on silicon substrates

Published:2014-05-11 Issue:6 Volume:8 Page:482-488
ISSN:1749-4885
Container-title:Nature Photonics
language:en
Short-container-title:Nature Photon

Author:

Chaisakul Papichaya,Marris-Morini Delphine^ORCID,Frigerio Jacopo,Chrastina Daniel,Rouifed Mohamed-Said,Cecchi Stefano,Crozat Paul,Isella Giovanni,Vivien Laurent

Publisher

Springer Science and Business Media LLC

Subject

Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://www.nature.com/articles/nphoton.2014.73.pdf

Reference45 articles.

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2. Miller, D. A. B. Device requirements for optical interconnects to silicon chips. Proc. IEEE 97, 1166–1185 (2009).

3. Wada, K. A new approach of electronics and photonics convergence on Si CMOS platform: how to reduce device diversity of photonics for integration. Adv. Opt. Technol. 2008, 807457 (2008).

4. Kuo, Y., Chen, H.-W. & Bowers, J. E. High speed hybrid silicon evanescent electroabsorption modulator. Opt. Express 16, 9936–9941 (2008).

5. Fang, A. W. et al. Electrically pumped hybrid AlGaInAs-silicon evanescent laser. Opt. Express 14, 9203–9210 (2006).

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