Wearable bio-adhesive metal detector array (BioMDA) for spinal implants

Author:

Li JianORCID,Jia ShengxinORCID,Li DengfengORCID,Chow Lung,Zhang QiangORCID,Yang Yiyuan,Bai Xiao,Qu Qingao,Gao Yuyu,Li Zhiyuan,Li Zongze,Shi Rui,Zhang Binbin,Huang YaORCID,Pan Xinyu,Hu Yue,Gao Zhan,Zhou JingkunORCID,Park WooYoungORCID,Huang XingcanORCID,Chu Hongwei,Chen ZhenlinORCID,Li Hu,Wu PengchengORCID,Zhao Guangyao,Yao KuanmingORCID,Hadzipasic Muhamed,Bernstock Joshua D.,Shankar Ganesh M.ORCID,Nan KewangORCID,Yu XingeORCID,Traverso GiovanniORCID

Abstract

AbstractDynamic tracking of spinal instrumentation could facilitate real-time evaluation of hardware integrity and in so doing alert patients/clinicians of potential failure(s). Critically, no method yet exists to continually monitor the integrity of spinal hardware and by proxy the process of spinal arthrodesis; as such hardware failures are often not appreciated until clinical symptoms manifest. Accordingly, herein, we report on the development and engineering of a bio-adhesive metal detector array (BioMDA), a potential wearable solution for real-time, non-invasive positional analyses of osseous implants within the spine. The electromagnetic coupling mechanism and intimate interfacial adhesion enable the precise sensing of the metallic implants position without the use of radiation. The customized decoupling models developed facilitate the precise determination of the horizontal and vertical positions of the implants with incredible levels of accuracy (e.g., <0.5 mm). These data support the potential use of BioMDA in real-time/dynamic postoperative monitoring of spinal implants.

Publisher

Springer Science and Business Media LLC

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3