Freezing solute atoms in nanograined aluminum alloys via high-density vacancies

Author:

Wu ShenghuaORCID,Soreide Hanne S.,Chen Bin,Bian Jianjun,Yang Chong,Li Chunan,Zhang Peng,Cheng Pengming,Zhang Jinyu,Peng Yong,Liu GangORCID,Li YanjunORCID,Roven Hans J.ORCID,Sun JunORCID

Abstract

AbstractLow-temperature decomposition of supersaturated solid solution into unfavorable intergranular precipitates is a long-standing bottleneck limiting the practical applications of nanograined aluminum alloys that are prepared by severe plastic deformation. Minimizing the vacancy concentration is generally regarded as an effective approach in suppressing the decomposition process. Here we report a counterintuitive strategy to stabilize supersaturated solid solution in nanograined Al-Cu alloys via high-density vacancies in combination with Sc microalloying. By generating a two orders of magnitude higher concentration of vacancies bonded in strong (Cu, Sc, vacancy)-rich atomic complexes, a high thermal stability is achieved in an Al-Cu-Sc alloy that precipitation is nearly suppressed up to ~230 °C. The solute-vacancy complexes also enable the nanograined Al-Cu alloys with higher strength, greater strain hardening capability and ductility. These findings provide perspectives towards the great potentials of solute-vacancy interaction and the development of nanograined alloys with high stability and well-performed mechanical properties.

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

General Physics and Astronomy,General Biochemistry, Genetics and Molecular Biology,General Chemistry,Multidisciplinary

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3