Molecular-level hybridization of single-walled carbon nanotubes and a copper complex with counterbalanced electrostatic interactions

Author:

Kim Mi-JeongORCID,Kim Hyeonbeom,Kim Jungmo,Lee Yeo JinORCID,Lee Wonki,Hwang Jun Yeon,Kim Ki KangORCID,Jeong Hee JinORCID

Abstract

AbstractHybridization and wet processibility are highly desired development strategies for next-generation nanomaterials. In particular, the hybridization of carbon nanotubes (CNTs) and transition metals has been investigated for decades owing to the numerous advantages, such as high mechanical and electrical properties. However, manufacturing nano-hybridized CNTs/transition metals is complicated, and no studies have been reported on the dispersion and hybridization of transition metals with single-walled CNTs (SWCNTs) without any harsh or destructive methods due to the strong van der Waals forces. Herein, we demonstrate a one-step dispersion/hybridization of SWCNTs and a Cu-based complex and provide a mechanism derives from counterbalancing the electrostatic interactions via molecular-level charge transfer. The Cu-based complex-hybridized SWCNTs self-assemble and demonstrate suitable viscoelastic behaviors for various printing or coating processes. Finally, the nanostructured SWCNTs/Cu nanoparticle exhibits multifunctional electrothermal properties, electromagnetic interference shielding performances, and flexibilities. The proposed metal-complex-hybridized SWCNTs dispersions provide a wet process guideline for producing nanostructured electrodes.

Funder

Korea Electrotechnology Research Institute

Publisher

Springer Science and Business Media LLC

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