Author:
Zhu Wenhui,Zheng Guang,Cao Sen,He Hu
Funder
National Basic Research Program (Grant No. 2015CB057206)
National Natural Science Foundation of China (National Science Foundation of China)
Open-End Fund for the Valuable and Precision Instruments of Central South University
Publisher
Springer Science and Business Media LLC
Reference44 articles.
1. Thompson, S. E. & Parthasarathy, S. Moore’s law: the future of Si microelectronics. Materials Today 9, 20–25 (2006).
2. Hobbs, C. et al. In Meeting Abstracts. 2782–2782 (The Electrochemical Society, 2012).
3. Lau, J. H. Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration. Journal of Electronic Packaging 136 (2014).
4. Fischer, A. C. et al. Integrating MEMS and ICs. 1, 15005 (2016).
5. Gambino, J. P., Adderly, S. A. & Knickerbocker, J. U. An overview of through-silicon-via technology and manufacturing challenges. (Elsevier Science Ltd., 2015).
Cited by
116 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献