The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-017-03324-5.pdf
Reference38 articles.
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3. Sorbello, R. S. Theory of electromigration. Solid State Physics 51, 159–231, doi: 10.1016/S0081-1947(08)60191-5 (1997).
4. Bosvieux, C. & Friedel, J. Sur l’electrolyse des alliages metalliques. J. Phys. Chem. Solids 23(1–2), 123–136, doi: 10.1016/0022-3697(62)90066-5 (1962).
5. Chen, S. W., Chen, C. M. & Liu, W. C. Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions. J. Electron. Mater. 27(11), 1193–1198, doi: 10.1007/s11664-998-0068-5 (1998).
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