Author:
Li Zikang,Li Guofeng,Huang Jie,Zhang Zhenrong,Yang Junbo,Yang Changming,Qian Yang,Xu Wenjie,Huang Huimin
Abstract
AbstractIn this paper, we combine inverse design concept and direct binary search algorithm to demonstrate three ultra-compact high efficiency and low crosstalk on-chip integrated optical interconnection basic devices in the entire wavelength range of 1,400–1600 nm based on silicon-on-insulator platform. A 90-degree waveguide bend with a footprint of only 2.4 × 2.4 μm2 is designed, whose transmission efficiency up to 0.18 dB. A waveguide crossing with a footprint of only 2.4 × 2.4 μm2 is designed, which can provide insertion loss of less than 0.5 dB and crosstalk (CL) of lower than − 19 dB. A same direction waveguide crossing with footprint of only 2.4 × 3.6 μm2 is designed, which can provide the insertion loss of less than 0.56 dB and the crosstalk of lower than − 21 dB. Then, we use them to form several ultra-compact optical interconnect basic structures and performed the simulation calculation. They overall achieve high performance. This will significantly improve the integration density.
Funder
the National Natural Science Foundation of China
the Guangxi Science Foundation
the Foundation of NUDT
the Hunan Provincial Natural Science Foundation of China
Program for New Century Excellent Talents in University
Publisher
Springer Science and Business Media LLC
Cited by
10 articles.
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