Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-019-40268-4.pdf
Reference29 articles.
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3. Tong, C. J. et al. Microstructure characterization of Al x CoCrCuFeNi high-entropy alloy system with multiprincipal elements. Metall. Mater. Trans. A 36, 881–893 (2005).
4. Zhang, Y. et al. Microstructures and properties of high-entropy alloys. Prog. Mater. Sci. 61, 1–93 (2014).
5. Zhang, Z. J. et al. Nanoscale origins of the damage tolerance of the high-entropy alloy CrMnFeCoNi. Nat. Commun. 6, 10143 (2015).
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