Intergranular fracture, grain-boundary structure, and dislocation-density interactions in FCC bicrystals
Author:
Funder
U.S. Department of Energy
Publisher
Springer Science and Business Media LLC
Link
https://www.nature.com/articles/s41598-024-72033-7.pdf
Reference34 articles.
1. Kheradmand, N., Vehoff, H. & Barnoush, A. An insight into the role of the grain boundary in plastic deformation by means of a bicrystalline pillar compression test and atomistic simulation. Acta Mater. 61, 7454–7465. https://doi.org/10.1016/j.actamat.2013.08.056 (2013).
2. Bond, D. M. & Zikry, M. A. Differentiating between intergranular and transgranular fracture in polycrystalline aggregates. J. Mater. Sci. 53, 5786–5798. https://doi.org/10.1007/s10853-017-1847-2 (2018).
3. Miyamoto, H., Koga, H., Mimaki, T. & Hashimoto, S. Intergranular stress corrosion cracking of pure copper <111> tilt bicrystals. Interface Sci. 9, 281–286. https://doi.org/10.1023/A:1015167030009 (2001).
4. Robertson, I. M., Lee, T. C. & Birnbaum, H. K. Application of the in situ TEM deformation technique to observe how “clean” and doped grain boundaries respond to local stress concentrations. Ultramicroscopy 40, 330–338. https://doi.org/10.1016/0304-3991(92)90130-C (1992).
5. Guo, Y. Z., Li, F. D., Suo, T., Tang, Z. B. & Li, Y. L. A close observation on the deformation behavior of bicrystal copper under tensile loading. Mech. Mater. 62, 80–89. https://doi.org/10.1016/J.MECHMAT.2013.04.001 (2013).
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