Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-017-13617-4.pdf
Reference37 articles.
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3. Dharmadasa, R., Jha, M., Amos, D. A. & Druffel, T. Room temperature synthesis of a copper ink for the intense pulsed light sintering of conductive copper films. ACS Appl. Mater. Interfaces 5, 13227–13234 (2013).
4. Xu, P. & Hamilton, M. C. Reduced-loss ink-jet printed flexible CPW with copper coating. Ieee Microwave and Wireless Components Letters 23, 178–180 (2013).
5. Allen, M. L., Jaakkola, K., Nummila, K. & Seppa, H. Applicability of metallic nanoparticle inks in RFID applications. IEEE Trans. Compon. Packaging Technol. 32, 325–332 (2009).
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