High Throughput Discovery and Design of Strong Multicomponent Metallic Solid Solutions
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-018-26830-6.pdf
Reference37 articles.
1. Tracy, C. L. et al. High pressure synthesis of a hexagonal close-packed phase of the high-entropy alloy CrMnFeCoNi. Nat. Commun. 8, 1–6 (2017).
2. Zhang, F. et al. Polymorphism in a high-entropy alloy. Nat. Commun. 8, 1–7 (2017).
3. Gludovatz, B. et al. Exceptional damage-tolerance of a medium-entropy alloy CrCoNi at cryogenic temperatures. Nat. Commun. 7, 10602 (2016).
4. Zhang, W., Liaw, P. K. & Zhang, Y. Science and technology in high-entropy alloys. Sci. China Mater. 61, 2–22 (2018).
5. Yeh, J. W. Recent progress in high-entropy alloys. Ann. Chim. Sci. des Mater. 31, 633–648 (2006).
Cited by 77 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Cryogenic tensile behavior of CoNiCrMo medium entropy alloy;Journal of Alloys and Compounds;2024-11
2. High-throughput strategy to design high entropy alloys with an FCC matrix, L12 precipitates, and optimized yield stress;Materials & Design;2024-08
3. Cr content dependent lattice distortion and solid solution strengthening in additively manufactured CoFeNiCrx complex concentrated alloys – a first principles approach;Materials Today Communications;2024-08
4. High‐throughput preparation for alloy composition design in additive manufacturing: A comprehensive review;Materials Genome Engineering Advances;2024-07-03
5. Solid State Reduction Driven Synthesis of Mn Containing Multi-principal Component Alloys;Metallurgical and Materials Transactions A;2024-07-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3