Advanced packaging of chiplets for future computing needs

Author:

Das Sharma DebendraORCID,Mahajan Ravi V.ORCID

Publisher

Springer Science and Business Media LLC

Reference11 articles.

1. The Vision for the National Advanced Packaging Manufacturing Program (NIST, 2023); https://go.nature.com/3Wu1gPN

2. Iyer, S. S. Chips, dies, chiplets and dielets and heterogeneous integration. In 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) 8–11 (IEEE, 2022); https://doi.org/10.1109/EDTM53872.2022.9798163

3. Heterogeneous Integration Roadmap Ch. 1 (IEEE, SEMI and ASME, 2019); https://go.nature.com/3wtYz69

4. Heterogeneous Integration Roadmap Ch. 22 (IEEE, SEMI and ASME, 2024); https://go.nature.com/44SiUyJ

5. Das Sharma, D., Pasdast, G., Tiagaraj, S. & Aygün, K. Nat. Electron. 7, 244–254 (2024).

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