Direct ink writing of three-dimensional thermoelectric microarchitectures-Reference-Cited by-同舟云学术

Direct ink writing of three-dimensional thermoelectric microarchitectures

Published:2021-08 Issue:8 Volume:4 Page:579-587
ISSN:2520-1131
Container-title:Nature Electronics
language:en
Short-container-title:Nat Electron

Author:

Kim Fredrick,Yang Seong Eun,Ju Hyejin^ORCID,Choo Seungjun,Lee Jungsoo,Kim Gyeonghun,Jung Soo-ho,Kim Suntae,Cha Chaenyung,Kim Kyung Tae,Ahn Sangjoon^ORCID,Chae Han Gi^ORCID,Son Jae Sung^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials

Link

https://www.nature.com/articles/s41928-021-00622-9.pdf

Reference54 articles.

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3. Pletcher, N. M. et al. A 52 μW wake-up receiver with –72 dBm sensitivity using an uncertain-IF architecture. IEEE J. Solid-State Circuits 44, 269–280 (2009).

4. Gilbert, J. M. & Balouchi, F. Comparison of energy harvesting systems for wireless sensor networks. Inter. J. Autom. Comput. 5, 334–347 (2008).

5. Zhang, Y. et al. A batteryless 19 μW MICS/ISM-band energy harvesting body sensor node SoC for ExG applications. IEEE J. Solid-State Circuits 48, 199–213 (2013).

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