Three orthogonal ultrasounds fabricate uniform ternary Al-Sn-Cu immiscible alloy
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/srep36718.pdf
Reference32 articles.
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3. Zhai, W., Hu, L., Geng, D. L. & Wei, B. Thermodynamic properties and microstructure evolution of ternary Al-10%Cu-x%Sn immiscible alloys. J. Alloys Compd. 627, 402–409 (2015).
4. Bertelli, F. et al. Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al-Sn-(Si, Cu) alloys. Mater. Design 72, 31–42 (2015).
5. Silva, A., Spinelli, J. E. & Garcia, A. Thermal parameters and microstructure during transient directional solidification of a monotectic Al-Bi alloy. J. Alloy Compd. 475, 347–351 (2009).
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