Self-assembled three dimensional network designs for soft electronics-Reference-Cited by-同舟云学术

Self-assembled three dimensional network designs for soft electronics

Published:2017-06-21 Issue:1 Volume:8 Page:
ISSN:2041-1723
Container-title:Nature Communications
language:en
Short-container-title:Nat Commun

Author:

Jang Kyung-In,Li Kan,Chung Ha Uk,Xu Sheng,Jung Han Na,Yang Yiyuan,Kwak Jean Won,Jung Han Hee,Song Juwon,Yang Ce,Wang Ao,Liu Zhuangjian^ORCID,Lee Jong Yoon,Kim Bong Hoon,Kim Jae-Hwan,Lee Jungyup,Yu Yongjoon,Kim Bum Jun,Jang Hokyung,Yu Ki Jun,Kim Jeonghyun,Lee Jung Woo,Jeong Jae-Woong,Song Young Min,Huang Yonggang,Zhang Yihui,Rogers John A.

Publisher

Springer Science and Business Media LLC

Subject

General Physics and Astronomy,General Biochemistry, Genetics and Molecular Biology,General Chemistry

Link

http://www.nature.com/articles/ncomms15894.pdf

Reference55 articles.

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2. Vashist, S. K., Luppa, P. B., Yeo, L. Y., Ozcan, A. & Luong, J. H. T. Emerging technologies for next-generation point-of-care testing. Trends Biotechnol. 33, 692 (2015).

3. Rogers, J. A. Electronics for the human body. JAMA 313, 561 (2015).

4. Lacour, S. P., Courtine, G. & Guck, J. Materials and technologies for soft implantable neuroprostheses. Nat. Rev. Mater. 1, 16063 (2016).

5. Someya, T., Bao, Z. N. & Malliaras, G. G. The rise of plastic bioelectronics. Nature 540, 379 (2016).

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