Author:
Maidenberg Daniel A.,Volksen Willi,Miller Robert D.,Dauskardt Reinhold H.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,General Chemistry
Reference26 articles.
1. Miller, R.D. et al. Porous organosilicates using sacrificial macromolecular porogens. Polym. Mater. Sci. Eng. 87, 425–426 (2002).
2. Hedrick, J.L. et al. Templating nanoporosity in thin-film dielectric insulators. Adv. Mater. 10, 1049–1053 (1998).
3. Liu, J. et al. Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films. Appl. Phys. Lett. 81, 4180–4182 (2002).
4. Maidenberg, D.A., Volksen, W., Miller, R.D. & Dauskardt, R.H. in International Interconnect Technology Conference 48–50 (IEEE, 1–4 June, Burlingame, California, 2003).
5. Lane, M., Dauskardt, R.H., Krishna, N. & Hashim, I. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers. J. Mater. Res. 15, 203–211 (2000).
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