Abstract
AbstractTactile sensing has been a key challenge in robotic haptics. Inspired by how human skin sense the stress field with layered structure and distributed mechanoreceptors, we herein propose a design for modular multi-parameter perception electronic skin. With the stress field sensing concept, complex tactile signals can be transformed into field information. By analyzing the stress field, the real-time three-dimensional forces can be resolved with 1.8° polar angle resolution and 3.5° azimuthal angle resolution (achieved up to 71 folds of improvement in spatial resolution), we can also detect the hardness of object in contact with the electronic skin. Moreover, we demonstrate random assembly of the sensing arrays and integration of our electronic skin onto differently curved surfaces do not lead to any measurement variation of the stress field. This result reveals that the sensing elements in our electronic skin system can be modularly made and exchanged for specific applications.
Funder
Guangdong Science and Technology Department
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,General Materials Science
Cited by
20 articles.
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