Cathode Growth at the Air-solution Interface in the Electrodeposition of Copper
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/220574a0.pdf
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Lateral Growth of Polypyrrole Electropolymerized along Hydrophobic Insulative Substrates;ECS Electrochemistry Letters;2014-04-30
2. A novel preparation of gold films by electrodeposition at the interface between a Na(AuCl4)-CuSO4 aqueous phase and an immiscible hexyl acetate organic phase;Journal of Applied Electrochemistry;1997
3. Preparation of Metallic Films by Electrodeposition at the Interface between Two Liquid Phases;Materials Transactions, JIM;1993
4. Morphological and electrochemical study of a zinc-leaf electrodeposited at the butyl acetate/zinc sulfate solution interface;Electrochimica Acta;1980-04
5. Electrodeposition along the Air‐Solution Interface: I . Experimental Investigation;Journal of The Electrochemical Society;1975-01-01
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