Non-destructive Inspection Technique Using a Terahertz Wave to Inspect the Alignment of the Internal Chip in Semiconductor Package
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Published:2024-06-30
Issue:3
Volume:44
Page:165-171
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ISSN:1225-7842
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Container-title:JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING
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language:en
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Short-container-title:JKSNT
Author:
Kim Sang-Il,Kim Heon-Su,Kim Hak-Sung
Publisher
The Korean Society of Nondestructive Testing