Micromechanical simulations of microstructure-sensitive Stage I fatigue crack growth
Author:
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1046/j.1460-2695.1999.00157.x/fullpdf
Reference13 articles.
1. A first stage in the development of micromechanical simulations of the crystallographic propagation of fatigue cracks under multiaxial loading;Doquet;Fatigue Fract. Engng Mater. Struct.,1998
2. Modelling of small fatigue crack growth interacting with grain boundary;Tanaka;Engng Fracture Mech.,1986
3. Short and long fatigue crack growth: a unified model;De Navarro;Phil. Mag. A,1988
4. Modelling the threshold conditions for propagation of Stage I fatigue cracks;Wilkinson;Acta Mater.,1998
5. The condition for the cyclic plastic deformation of the crack tip: the influence of dislocation obstacles;Pippan;Int. J. Fracture,1992
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Full-field Strain Measurements for Microstructurally Small Fatigue Crack Propagation Using Digital Image Correlation Method;Journal of Visualized Experiments;2019-01-16
2. Micromechanical investigation and numerical simulation of fatigue crack formation in welded joints;Engineering Fracture Mechanics;2018-07
3. Strain accumulation during microstructurally small fatigue crack propagation in bcc Fe-Cr ferritic stainless steel;Acta Materialia;2018-02
4. Modeling transgranular crack growth in random 3D grain structures under cyclic loading;PROBABILIST ENG MECH;2017
5. Micromechanical modeling of short fatigue cracks;Current Opinion in Solid State and Materials Science;2014-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3