Semiconductor Plasmon Enhanced Upconversion toward a Flexible Temperature Sensor-Reference-Cited by-同舟云学术

Semiconductor Plasmon Enhanced Upconversion toward a Flexible Temperature Sensor

Published:2023-01-16 Issue:3 Volume:15 Page:4469-4476
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Zhang Weina¹^ORCID,Huang Xingwu²,Liu Wenjie¹,Gao Zhensen¹,Zhong Liyun¹,Qin Yuwen¹,Li Baojun²,Li Juan²^ORCID

Affiliation:

1. Guangdong Provincial Key Laboratory of Photonics Information Technology, School of Information Engineering, Guangdong University of Technology, Guangzhou510006, China

2. Institute of Nanophotonics, Jinan University, Guangzhou511443, China

Funder

Guangzhou Municipal Science and Technology Bureau

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.2c18412

Reference39 articles.

1. Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis

2. Wearable Electronics Based on 2D Materials for Human Physiological Information Detection

3. Ultrabroadband Tuning and Fine Structure of Emission Spectra in Lanthanide Er-Doped ZnSe Nanosheets for Display and Temperature Sensing

4. Innovative Nanosensor for Disease Diagnosis

5. Sensitive Wearable Temperature Sensor with Seamless Monolithic Integration

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