Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming-Reference-Cited by-同舟云学术

Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming

Published:2022-03-17 Issue:12 Volume:14 Page:14774-14782
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Bachmann Adam L.¹²^ORCID,Hanrahan Brendan³,Dickey Michael D.²^ORCID,Lazarus Nathan³^ORCID

Affiliation:

1. Oak Ridge Associated Universities (ORAU) Fellowship Program at U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, Maryland 20783, United States

2. Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States

3. Sensors and Electron Devices Directorate, U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, Maryland 20783, United States

Funder

Army Research Laboratory

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.2c01027

Reference75 articles.

1. Graphene kirigami

2. Introduction to Mathematical Origami and Origami Engineering

3. A method for building self-folding machines

4. Microfabricated Foldable Wings for Centimeter-Scale Microflyers

5. Accommodating Thickness in Origami-Based Deployable Arrays1

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