Dynamic Electrolyte Spreading during Meniscus-Confined Electrodeposition and Electrodissolution of Copper for Surface Patterning
Author:
Affiliation:
1. Department of Chemical Engineering, BITS Pilani, Goa Campus, Zuarinagar, Goa 403726, India
Funder
Science and Engineering Research Board
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.2c04798
Reference56 articles.
1. Additive manufacturing by template-assisted 3D electrodeposition: Nanocrystalline nickel microsprings and microspring arrays
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