High Interfacial Thermal Stability of Flexible Flake-Structured Aluminum Thin-Film Electrodes for Bi<sub>2</sub>Te<sub>3</sub>-Based Thermoelectric Devices-Reference-Cited by-同舟云学术

High Interfacial Thermal Stability of Flexible Flake-Structured Aluminum Thin-Film Electrodes for Bi₂Te₃-Based Thermoelectric Devices

Author:

Wang Yaling¹,Zhu Pengcheng²,Li Wenqiang¹,Liu Xiaobiao¹,Li Hui¹,Deng Yuan³⁴^ORCID,Tan Ming¹^ORCID

Affiliation:

1. College of Science, Henan Agricultural University, Zhengzhou 450002, China

2. Key Laboratory of Materials Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou 450001, China

3. Hangzhou Innovation Institute, Beihang University, Hangzhou 310052, China

4. Research Institute for Frontier Science, Beihang University, Beijing 100083, China

Funder

Henan Agricultural University

Ministry of Science and Technology of the People's Republic of China

China Postdoctoral Science Foundation

Science and Technology Department of Henan Province

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

Reference33 articles.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献