Development of Environmentally Benign Pressure-Sensitive Adhesive Systems via Modification of Substrate Properties-Reference-Cited by-同舟云学术

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Development of Environmentally Benign Pressure-Sensitive Adhesive Systems via Modification of Substrate Properties

Published:2002-10-10 Issue:23 Volume:41 Page:5668-5675
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Severtson Steven J.¹,Wang ¹,Kroll Mark S.²

Affiliation:

1. Kaufert Laboratory, Department of Wood and Paper Science, University of Minnesota, 2004 Folwell Avenue, St. Paul, Minnesota 55108

2. H.B. Fuller Company, 1200 Willow Lake Boulevard, St. Paul, Minnesota 55110

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/ie0204383

Reference24 articles.

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Highly Stretchable and Permeable Liquid Metal Micromesh Conductor by Physical Deposition for Epidermal Electronics;ACS Applied Materials & Interfaces;2022-03-09

2. Glass‐transition temperature of a polyacrylate latex film and its water whitening resistance;Journal of Applied Polymer Science;2019-08-13

3. Size distribution analysis of microstickies treated by enzyme mixtures in papermaking whitewater;March 2019;2019-04-01

4. Cutinases catalyze polyacrylate hydrolysis and prevent their aggregation;Polymer Degradation and Stability;2019-01

5. High-Performance Pressure-Sensitive Adhesives from Renewable Triblock Copolymers;Biomacromolecules;2015-07-27

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