Hierarchical Porous Film with Layer-by-Layer Assembly of 2D Copper Nanosheets for Ultimate Electromagnetic Interference Shielding-Reference-Cited by-同舟云学术

Hierarchical Porous Film with Layer-by-Layer Assembly of 2D Copper Nanosheets for Ultimate Electromagnetic Interference Shielding

Published:2021-01-11 Issue:1 Volume:15 Page:829-839
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Choi Ho Kwang¹,Lee Aram²,Park Mina²,Lee Dong Su²^ORCID,Bae Sukang²^ORCID,Lee Seoung-Ki²^ORCID,Lee Sang Hyun³^ORCID,Lee Takhee⁴^ORCID,Kim Tae-Wook¹^ORCID

Affiliation:

1. Department of Flexible and Printable Electronics, LANL-CBNU Engineering Institute-Korea, Jeonbuk National University, Jeonju 54896, Republic of Korea

2. Functional Composite Materials Research Center, Institute of Advanced Composite Materials, Korea Institute of Science and Technology, Jeollabuk-do 55324, Republic of Korea

3. School of Chemical Engineering, Chonnam National University, Gwangju 61186, Republic of Korea

4. Department of Physics and Astronomy, and Institute of Applied Physics, Seoul National University, Seoul 08826, Republic of Korea

Funder

National Research Foundation of Korea

Korea Institute for Advancement of Technology

Korea Institute of Science and Technology

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsnano.0c07352