Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems

Author:

Song Min-Kyu12ORCID,Kang Ji-Hoon12,Zhang Xinyuan23,Ji Wonjae4,Ascoli Alon5,Messaris Ioannis5,Demirkol Ahmet Samil5,Dong Bowei6,Aggarwal Samarth6ORCID,Wan Weier7,Hong Seok-Man8,Cardwell Suma George9,Boybat Irem10,Seo Jae-sun11,Lee Jang-Sik4ORCID,Lanza Mario12ORCID,Yeon Hanwool13,Onen Murat14ORCID,Li Ju315ORCID,Yildiz Bilge315ORCID,del Alamo Jesús A.14,Kim Seyoung4ORCID,Choi Shinhyun8ORCID,Milano Gianluca16ORCID,Ricciardi Carlo17ORCID,Alff Lambert18ORCID,Chai Yang19,Wang Zhongrui20,Bhaskaran Harish6ORCID,Hersam Mark C.212223ORCID,Strukov Dmitri24,Wong H.-S. Philip7,Valov Ilia2526ORCID,Gao Bin27ORCID,Wu Huaqiang27ORCID,Tetzlaff Ronald5,Sebastian Abu10,Lu Wei28,Chua Leon29,Yang J. Joshua30,Kim Jeehwan123ORCID

Affiliation:

1. Department of Mechanical Engineering, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States

2. Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States

3. Department of Materials Science and Engineering, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States

4. Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea

5. Chair of Fundamentals of Electrical Engineering, Institute of Principles of Electrical and Electronic Engineering, Faculty of Electrical and Computer Engineering, School of Engineering Sciences, Technische Universität Dresden, Dresden 01069, Germany

6. Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom

7. Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States

8. The School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea

9. Sandia National Laboratories, Albuquerque, New Mexico 87123, United States

10. IBM Research Europe, 8803 Rüschlikon, Switzerland

11. School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, Arizona 85281, United States

12. Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia

13. School of Materials Science and Engineering, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea

14. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States

15. Department of Nuclear Science and Engineering, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States

16. Advanced Materials Metrology and Life Sciences Division, Istituto Nazionale di Ricerca Metrologica (INRiM), Strada delle Cacce, Torino 10135, Italy

17. Department of Applied Science and Technology, Politecnico di Torino, c.so Duca degli Abruzzi, Torino 10129, Italy

18. Advanced Thin Film Technology Division, Institute of Materials Science, Technische Universität Darmstadt, Darmstadt 64287, Germany

19. Department of Applied Physics, Hong Kong Polytechnic University, Hong Kong 999077, China

20. Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, China

21. Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States

22. Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States

23. Department of Electrical and Computer Engineering, Northwestern University, Evanston, Illinois 60208, United States

24. Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, California 93106, United States

25. Research Centre Juelich, PGI-7, Wilhelm-Johnen-Str., Juelich 52425, Germany

26. Institute of Electrochemistry and Energy Systems “Acad. E. Budewski”, Bulgarain Academy of Sciences, “Acad. G. Bochev 10” str., 1113 Sofia, Bulgaria

27. School of Integrated Circuits, Tsinghua University, Beijing 100084, China

28. Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, Michigan 48109, United States

29. Department of Electrical Engineering and Computer Sciences, University of California Berkeley, Berkeley, California 94720, United States

30. Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States

Funder

Samsung Science and Technology Foundation

Semiconductor Research Corporation

Office of Science

National Natural Science Foundation of China

Electronic Components and Systems for European Leadership

Division of Materials Research

Research Grants Council, University Grants Committee

European Metrology Programme for Innovation and Research

HORIZON EUROPE European Innovation Council

National Research Foundation of Korea

Deutsche Forschungsgemeinschaft

H2020 Future and Emerging Technologies

H2020 LEIT Biotechnology

MIT-IBM Watson AI Lab

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

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