Biomimetic Copper Forest Wick Enables High Thermal Conductivity Ultrathin Heat Pipe-Reference-Cited by-同舟云学术

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Biomimetic Copper Forest Wick Enables High Thermal Conductivity Ultrathin Heat Pipe

Published:2021-04-01 Issue:4 Volume:15 Page:6614-6621
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Luo Jia-Li¹²,Mo Dong-Chuan³²^ORCID,Wang Ya-Qiao³²,Lyu Shu-Shen³²

Affiliation:

1. School of Materials Science and Engineering, Sun Yat-sen University, Guangzhou 510275, China

2. Guangdong Engineering Technology Research Centre for Advanced Thermal Control Material and System Integration (ATCMSI), Guangzhou 510275, China

3. School of Materials, Sun Yat-sen University, Guangzhou 510275, China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsnano.0c09961

Reference59 articles.

1. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

2. Superior Thermal Conductivity of Single-Layer Graphene

3. Ultrahigh Thermal Conductive yet Superflexible Graphene Films

4. Large-Area Freestanding Graphene Paper for Superior Thermal Management

5. Ultrathin Flexible Graphene Film: An Excellent Thermal Conducting Material with Efficient EMI Shielding

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