1. Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
2. Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
3. State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, and International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China
4. School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, United States
5. Department of Electrical and Computer Engineering, Northeastern University, Boston, Massachusetts 02115, United States
6. Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
7. School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
8. Department of Materials Science, Fudan University, Shanghai 200433, China
9. Department of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
10. Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute for Nano/Biotechnology, Northwestern University, Evanston, Illinois 60208, United States